OPTIcoat ST22+ - Spin Coating
Product Information
The future technology in the semiconductor industry and production-
Stand-Alone Spin Coating System with "Covered Chuck" within process:OPTIcoat ST 22+
- Stand - Alone Spin Coating System with "Covered Chuck" technology with Hotplate for Wafers up to Ø 8" (Ø 200 mm) and substrates up to 6" x 6" (150 mm x 150 mm), for traditional open bowl or covered chuck spinning and advanced proximity baking
System consists of:
- Stand - Alone cabinet with all process modules integrated
- Spinner system with "Covered Chuck" technology and automatic substrate pin lift
- Multi piece process bowl (easily dismountable for cleaning purposes) with splash ring
- Hotplate OPTIhot HB 20+ with programmable lifting pins (proximity)for 2" - 8" Wafer
- Programmable Nitrogen (N2) blow
- Input display unit with touch for each system
- USB 2.0 port for data exchange
- Including software for PC / Notebook - For more comfortable recipe writing and storage
- Including an ENGLISH manual on standard paper and a CD-ROM
- Price without installation and training
- Requires at least one chuck (Not included !)
Technical Data:- Voltage: UAC= 3 x 400 V / N / PE / 50 Hz (60 Hz) / 16A
- Motor-Speed: 1 up to 10,000rpm in 1rpm steps
- Motor-Acceleration ramp: 1 up to 50,000 rpm/sec in steps 1rpm/sec
- Spinning time: 1 up to 999 s - Adjustable in 0.1 s steps
- Substrate size: Up to Ø 8" (Ø 200 mm) or 6" x 6" (150 mm x 150 mm)
- Process bowl: Standard made of Polypropylene (PP)
- Process exhaust: Outer diameter OD 110 mm, 200m3/h
- Cabinet exhaust #1: Outer diameter OD 110 mm, 200m3/h
- Cabinet / HP exhaust #2: Outer diameter OD 110 mm, 200m3/h
- Drain: 5 liter waste tank and high-level sensor, inside the cabinet
- Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
- Vacuum: -0.8 ± 0.2 bar
- Nitrogen (N2) Optional: 4.0 ± 0.5 bar
- CE marked system
Hotplate:- Temperature range: Up to 300°C - Adjustable in 0.1°C steps
- Hotplate time: 1 up to 999 s - Adjustable in 0.1 s steps
- Proximity: Programmable in 0.1 mm steps
- For Wafer: Up to Ø 8" (Ø 200 mm)
- For Substrate: Up to 6" x 6" (150 mm x 150 mm)
- Lifting pins: For Ø 2" up to Ø 8"
Chuck: Option
Dispense: Option
Nozzle: Option
Hotplate: Option