Maximus 806 - Automatic Cluster
Fully automatic cluster system for a wide protfolio of applications. Can be equiped with different Modules like Coaters, Cleaners, Developers, Hot-, Cool- and Primer-plates.
Can Process Wafers up to 8" and Square Substrates up to 6"x6"
Product Information
MAXIMUS Series
Automatic Microcluster Systems for Lithography Processes
The fully-automated microcluster systems of the Maximus Series are designed for single-substrate production processes in the semiconductor industry. The system platform handles wafer sizes from Ø 2” up to Ø 750 mm and substrate sizes from 2” x 2” up to 500 mm x 500 mm. According to the process requirements all Maximus systems can be equipped flexibly with different process units like coater, developer, cleaner, hot, cool and primer plates. The Maximus Series provides all features needed for state of the art production tasks like thin-wafer handling, UV curing or Lift-Off.
in the Semiconductor IndustryMAXIMUS 806
Ø 2” up to Ø 8” | 2” x 2” up to 6” x 6”
Typical substrates: Si, SiGe, SiC, GaN, GaAs, Sapphire
The Maximus 806 is designed for high level wafer production processes and can be equipped with up to 6 process units and two robots, one for the I/O and one for the process units handling.The System consists of:
- 1 Cabinet MAXIMUS 806
- 1 5-axis main robot
- wafer transport between loading unit, spinner and hot /cool plate stack - 1 Loading Unit:
- 4 cassette loading stations
- 3-axis robot, carrying wafer from cassette to main robot
- self centering end effector - 2 End effector vacuum standard for Ø 125mm and Ø 150mm wafer
- 1 Flat touch screen monitor
- 1 Computer as controller and user interface
- 1 Light beacon (red , yellow , green )
- 1 Remote control, for quick log file checking for service and maintenance purposes via modem or ISDN interface
- 1 Software for easy programming of station recipe and flow recipe at the system or on a connected PC
- 1 CE marked system
- 1 ENGLISH manual on standard paper and a CD-ROM
Technical Data:
- Voltage: UAC= 3 x 400 V / N / PE / 50 Hz (60Hz) / 32A
- Spinner Coater System: Motor speed: 1 up to 10,000rpm in 1rpm steps (depending on substrate size and load)
- Motor acceleration ramp: 1 up to 50,000 rpm/sec in steps 1rpm/sec (depending on substrate size and load)
- Spinning time: 0.1 up to 999sec in 0.1sec steps
- Process bowl: Standard made of Polypropylene (PP)
- Standard drain: 5 liter waste tank with high-level sensor inside the cabinet
- Pressure: Clean Dry Air (CDA) 8 ± 2 bar
- Vacuum: -0.8 ± 0.2 bar
- Nitrogen N2 (optional): 4.0 ± 0.5 bar
- Exhaust: OD250mm, 1000 m3/h