OPTIhot HB20 - Hotplate
Product Information
The future technology in the semi conductor industry and production-
bench mounted Hotplate System for typical lithography baking applications:OPTIhot HB 20
- Bench Mounted Hotplate System for wafers up to Ø 8" (Ø 200 mm)and substrates up to 6" x 6" (150 mm x 150 mm)
System consists of:
- Hotplate System with cover
- Lifting pins after process for 2" - 8" wafer
- Input controller
- Preset and calibrated temperature controller
- Including an ENGLISH manual as download
- Hotplate System with cover and controller
- Price without installation and training
Technical data:
- Voltage: UAC= 110 V / N / PE / 60 Hz / 16A or UAC= 230 V / N / PE / 50 Hz / 16A
- Temperature range: Up to 250°C - Adjustable in 1°C steps
- Hotplate time: 1 up to 999 s - Adjustable in 0.1 s steps
- Substrate size: Up to Ø 8" (Ø 200 mm) or 6" x 6" (150 mm x 150 mm)
- Process exhaust: Outer diameter OD 38 mm, 30m3/h
- Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
- Vacuum: -0.8 ± 0.2 bar
- Nitrogen (N2): 4.0 ± 0.5 bar
- CE marked system
Hotplate: Option